Excusive for Thailand
SiC Wafer Measurement Solutions for the Semiconductor Industry in Thailand
Advanced SiC wafer measurement solutions in Thailand for semiconductor manufacturers. Sub-nanometer capacitive wafer metrology with floating wafer capability and local engineering support.
Free • Engineering analysis • No obligation
Overview
Integrated SiC Wafer Measurement Architecture
Wafer Thickness Measurement
Proforma 300iSA
Precise wafer thickness measurement is critical for semiconductor manufacturing processes such as wafer lapping and polishing.
High-Precision Electrical Measurement
Accumeasure Gen 3
Electrical measurement systems are essential for semiconductor materials research and device characterization.
We understand the market
SiC Wafer Measurement Thailand for Semiconductor Manufacturing
Thailand is emerging as a regional hub for power semiconductor and SiC device production. Reliable SiC wafer measurement Thailand capability is critical for yield, qualification and long-term process stability. Exyne Asia delivers a complete wafer metrology architecture combining Proforma 300iSA, Digital Accumeasure Gen 3 electronics and precision capacitive probes – with local support in Thailand.- 10+ Years Semiconductor Experience
- Local Engineering Support in Thailand
- Trusted Semiconductor Metrology Technology
We understand the market
Measurement challenges in semiconductor manufacturing
Modern semiconductor manufacturing requires extremely precise wafer thickness measurement and process monitoring to maintain yield and device performance.
Surface
Reflectivity Variation
Variations in SiC wafer surface reflectivity can impact measurement accuracy and require stable capacitive measurement technology.
Hard Substrate
Processing
SiC wafers are extremely hard and difficult to handle. Mechanical stress and processing complexity increase the risk of measurement errors.
Floating Wafer Configurations
Non-contact or floating setups introduce instability during measurement. Even minimal movement can significantly affect accuracy.
Sub-Micron Tolerances
Modern applications require extremely tight tolerances. Small deviations at the sub-micron level can impact device performance and yield.We understand the technology
Advanced SiC Wafer Measurement Solutions for Thailand
To address these semiconductor metrology challenges, Exyne Asia integrates precision wafer measurement hardware, digital electronics and capacitive probes into a complete measurement architecture.Proforma 300iSA
SiC Wafer Thickness Measurement
The Proforma 300iSA provides automated 200mm and 300mm SiC wafer mapping for thickness, Total Thickness Variation (TTV), bow and warp measurement.- Automated wafer thickness mapping
- ASTM / SEMI compliant measurement
- High repeatability for SiC substrates
- Production-ready mechanical stability
Accumeasure Gen 3
High-Precision Capacitive Wafer Measurement Electronics
Digital Accumeasure Gen 3 replaces analog capacitive amplifiers with a 24-bit direct digital architecture.
- 0.1 nm resolution
- ±0.01% FSR linearity
- 20 kHz sample rate
- Ethernet & USB digital output
- Optional analog output (0–10V, ±10V)
- Multi-channel thickness mode
Supported Probe Architectures
- Single-ended probes (grounded wafers)
- 180° configuration (floating wafer thickness measurement)
- Push/Pull probes (reduced fringing effects)
Thickness Measurement Modes
- 2-channel thickness measurement
- 4-channel synchronized wafer mapping
Capacitive Probe Technology for SiC Wafer Measurement
Digital Accumeasure Gen 3 systems support a range of capacitive probe configurations designed for high-precision wafer thickness measurement in semiconductor applications.
These probe architectures enable stable measurement even in floating wafer configurations.
We understand your struggles
Frequently Asked Questions About SiC Wafer Measurement
What wafer sizes can be measured with the Proforma 300iSA system
The Proforma 300iSA system supports a wide range of wafer sizes, from smaller R&D wafers to full 300 mm production wafers.
This flexibility makes it suitable for both development environments and high-volume manufacturing.
What wafer parameters can be measured with this system?
Can floating wafers be measured?
How accurate is the SiC wafer thickness measurement?
What is SiC wafer thickness measurement used for?
Do you have more questions?
If you need more details or want to discuss your specific application, feel free to reach out.
Our team is happy to help you find the right measurement solution.
We are here to help you
Local Semiconductor Metrology Support in Thailand
Exyne Asia provides direct engineering support, wafer sample testing and system demonstrations for semiconductor manufacturers in Thailand.
- Direct coordination with Vitrek
- Free wafer sample measurement program
- Probe selection engineering support
- Installation & commissioning
Free SiC Wafer Sample Measurement
Request Your Free SiC Wafer Measurement Analysis
Send your SiC wafer sample and receive a full geometry analysis including thickness mapping, TTV, bow and warp evaluation.
You receive
- Full thickness report
- Bow & warp mapping
- Measurement repeatability evaluation
- TTV analysis summary
- Technical consultation
- Friendly metrology experts included